The concrete must be with a tensile strength of ≥1,5MPa, and allowed to be cured for at least 28 days, taking all the necessary maintenance measures during its curing period. The cementitious substrate must be properly prepared mechanically (e.g. grinding, shot blasting, milling etc.) to smooth out the irregularities, achieve an open- textured surface and ensure optimum adhesion.
SURFACE PREPARATION
o Conduct a Clean, Dry, and Sound (CDS) test on the concrete surface.
o Perform a moisture test using a moisture meter.
o Ensure residual moisture does not exceed 4–5%.
o Relative air humidity (RH): <70%
o Prepare the surface through scarification, grinding, or shot blasting to achieve a profile of 150–200 microns.
PRIMING: The surfaces require appropriate preparation, prior to the application of CP FLOORTEK Waterborne Epoxy Primer. The primer should be mixed in the given proportions supplied.
MIXING: First mix Component A- Resin part and Component B-Hardener part thoroughly, always add Component C- DM Water part after and keep mixing until uniform within the system. Always mix full pack sizes to avoid incorrect measure of ratio.
APPLICATION: The mixed material should be poured onto the prepared and primed substrate as soon as mixing is complete. It should be spread to the required thickness using a serrated trowel; with care taken not to overwork the resin, spreading evenly and slowly. Immediately after laying, the material should be rolled, using a spiked nylon roller, to remove slight trowel marks, and to assist air release. The rolling should be carried out using a ‘back and forth’ technique along the same path. An overlap of 50% with adjacent paths is recommended. Further light rolling may be required to remove surface imperfections, or for subsequent release of trapped air, but should be prior to the setting of the product. Allow a minimum of 72 hours curing before traffic exposure. The ideal application temperature should be between 23 deg.C to 30 deg.C. It is recommended to do a field trial prior to large scale application.